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QUALITY CREATES VALUE
REPUTATION BUILDS BRAND

2016

founded in 2016

60+

factory worker

OUR STORY

Suzhou Bochuan Automation Technology Co., Ltd.

Optocoupler Semiconductor Packaging:

Our flagship models include 1st-stage die bonders, 2nd-stage die bonders, lead trimming & deflashing equipment, dispersion molding machines, and lead flattening machines.

Founded in 2016 and located in the scenic Wuzhong Economic & Technological Development Zone, Suzhou, on the shores of Taihu Lake, we are a professional high-tech enterprise dedicated to providing non-standard customized equipment solutions. With a technical heritage dating back to 2006, we have earned 28 utility model patents, 8 software copyrights, and one invention patent in acceptance, and are recognized as a Suzhou High-Tech Enterprise.

4000+m²

existing production area

150+

export countries

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Suzhou Bochuan Automation Technology Series

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Founded in 2016 and located in the scenic Wuzhong Economic & Technological Development Zone of Suzhou, on the shores of Taihu Lake, we are a professional high-tech enterprise dedicated to non-standard customized equipment solutions. With a technical foundation built since 2006, we hold 28 utility model patents, 8 software copyrights, and one pending invention patent, and are recognized as a Suzhou High-Tech Enterprise. We focus on three core business segments: optocoupler semiconductor packaging, automotive interior laser engraving, and wire automatic rewinding, delivering tailored equipment to meet diverse industry needs. Backed by our R&D expertise and patent portfolio, we empower our clients with efficient, customized solutions that drive operational value.

Suzhou Bochuan Automation Technology

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Suzhou Bochuan Automation Technology

Established in 2016 and situated in Suzhou’s scenic Wuzhong Economic & Technological Development Zone along the shores of Taihu Lake, we are a Suzhou High-Tech Enterprise focused on delivering non-standard customized equipment solutions. With technical roots tracing back to 2006, we have secured 28 utility model patents, 8 software copyrights, and one pending invention patent, underscoring our R&D strength. Our expertise spans three key sectors: optocoupler semiconductor packaging (featuring 1st/2nd-stage die bonders and lead processing equipment), automotive interior laser engraving (offering automated loading, engraving and palletizing systems), and wire automatic rewinding (including specialized blasting wire rewinding machines). By combining our patented technologies with tailored engineering, we help clients enhance production efficiency and achieve their operational goals.

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